Commercial glue bonding processes can be simulated in the laboratory assessment using the latest Smithers Pira adhesive performance tester (PAPT 3) with five station rupture mechanism. In particular, the performance of hot melt packaging adhesives can be studied without the need for disruptive production line trials.
The PAPT 3 has been designed to allow complete control over the key bonding process parameters of open time, contact time, glue application weight, contact pressure, adhesive temperature and application speed.
In addition the machine can measure the strength of the joint after multiple pre-set open and/or contact times, without the need to remove the test pieces from the instrument. Thus, the user is able to predict the compatibility of any combination of adhesive and substrate with a process application.
Adhesive bonds prepared using the PAPT 3 are subsequently tested for long term creep and heat resistance.